Description
Specifications:
1)FULLY MODULAR DESIGN
2)100% JAPANESE CAPACITORS
3)SUPPORTS PS_ON# FUNCTION
4)INTERNAL CABLE-LESS DESIGN
5)ADVANCED COOLING ARCHITECTURE
6)INDUSTRIAL-GRADE, HIGH-RELIABILITY COMPONENTS
7)3RD GENERATION SILICON CARBIDE (SIC) SEMICONDUCTORS
8)MULTIPLE PROTECTIONS: OCP OVP UVP OPP SCP OTP SIP NLP
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